SECTION 4 DIAGRAMS
Note on Schematic Diagram: � All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. � All resistors are in � and 1/ W or less unless otherwise specified.
4
RM-NX7000
Note on Printed Wiring Board: � X : parts extracted from the component side. � Y : parts extracted from the conductor side. � : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.
� % : indicates tolerance. � C : panel designation. � A : B+ Line. � Power voltage is dc 4.5V and fed with regulated dc power supply from extermal power voltage jack. � Voltages and waveforms are dc with respect to ground under nosignal conditions. no mark : POWER ON � Voltages are taken with a VOM (Input impedance 10 M�). Voltage variations may be noted due to normal production tolerances. � Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. � Circled numbers refer to waveforms.
� Main boards is six-layer pritnted board. However, the patterns of layer 2 to 5 have not been included in this diagrams.
� IC1 (microcomputer) and IC7 (flash RAM) on Main board cannot be replaced individually. Replace it with Main board assembly for service.
� IC1 (microcomputer) and IC7 (flash RAM) on Main board cannot be replaced individually. Replace it with Main board assembly for service. * The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.
