SONY SPP99
Manual de Servicio

SPP-98/99
5-5. PRINTED WIRING BOARD � HAND MAIN SECTION �

� Semiconductor Location Ref. No. D3 D101 IC1 Q1 Q101 Q102 Q103 Location A-1 C-4 B-6 B-9 D-2 C-3 C-2 (Page 34)

(Page 34)

Note: � X : parts extracted from the component side. � Y : parts extracted from the conductor side. � r : Through hole. � b : Pattern from the side which enables seeing. (The other layer�s patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A) Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.

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