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1.3 Requirements for storage and baking after opening the antihumidity packaging (dry bag)
After a dry pack has been opened, all SMD packages within that bag must complete all solder reflow processing, including rework, within 168 hours (1 week), unless opened parts are stored in a dry cabinet at <10% RH. After this time, parts must be baked as per the below conditions before use. Heatproof trays (you will see clear �Heat Proof Tray� markings) are employed for some products. If the term of viability after opening the antihumidity packaging elapses during your manufacturing span, be sure to apply a baking process to the products with the heatproof tray before mounting the products. The recommended baking conditions are as follows: at 125 degrees C for 24 hours
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1.4 Analysis of nonconforming items
When you remove our semiconductor products to analyze a nonconforming item, it is recommended to remove them after baking under the conditions mentioned in 1.3 above. If you remove the product using hot air in a status where the resin has absorbed moisture, heat stress may cause package cracking or adhesion degradation of the resin, and the actual reason for nonconformity may not found easily.
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