PANASONIC KX-TDA6178
Manual de Servicio

KX-TDA6178

9.2.
9.2.1.

How To Replace a Flat Package IC
Preparation 9.2.3. Procedure

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

� PbF (: Pb free) Solder � Soldering Iron Tip Temperature of 700°F ± 20°F (370°C ± 10°C) Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil. � Flux Recommended Flux: Specific Gravity � 0.82. Type � RMA (lower residue, non-cleaning type) Note: See About Lead Free Solder (PbF: Pb free) (P.3).

1. Tack the flat pack IC to the PCB by temporarily soldering two diagonally opposite pins in the correct positions on the PCB.

9.2.2.

Removal Procedure

1. Put plenty of solder on the IC pins so that the pins can be completely covered. Note: If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

Be certain each pin is located over the correct pad on the PCB. 2. Apply flux to all of the pins on the IC.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. Being careful to not unsolder the tack points, slide the soldering iron along the tips of the pins while feeding enough solder to the tip so that it flows under the pins as they are heated.

3. While the solder melts, remove it together with the IC pins.

9.2.4.

Removing Solder From Between Pins

1. Add a small amount of solder to the bridged pins. 2. With a hot iron, use a sweeping motion along the flat part of the pin to draw the solder from between the adjacent pads.

When you attach a new IC to the board, remove all solder left on the land with some tools like a soldering wire. If some solder is left at the joint on the board, the new IC will not be attached properly.

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