18 HOW TO REPLACE FLAT PACKAGE IC
1 8 . 1 . Preparation
· SOLDER Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR19RMA · Soldering iron Recommended power consumption will be between 30 W to 40 W. Temperature of Copper Rod 662 ± 50°F (350 ± 10°C) (An expert may handle between 60 W to 80 W iron, but beginner might damage foil by overheating.) · Flux HI115 Specific gravity 0.863. (Original flux will be replaced daily.)
iron as shown in below figure.
1 8 . 2 . Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil. 2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
1 8 . 3 . M odif ic a t ion Procedure o f Bridge
1. Re-solder slightly on bridged portion. 2. Remove remained solder along pins employing soldering 47
