The circuit boards used in these models have been processed using Lead Free Solder. The boards are identified by the LF logo located close to the board designation e.g. H1 etc [ see example ]. The servicing of these boards requires special precautions to be taken as outlined below.
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is available under the following part numbers :
Part number 7-640-005-19 7-640-005-20 7-640-005-21 7-640-005-22 7-640-005-23 7-640-005-24 7-640-005-25 7-640-005-26 Diameter 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.6mm Remarks 0.25Kg 0.50Kg 0.50Kg 0.25Kg 1.00Kg 1.00Kg 1.00Kg 1.00Kg
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics. For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
