SONY HCDVR50
Manual de Servicio

HCD-VR50/VR70

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) For schematic diagrams.
Note: � All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. � All resistors are in � and 1/4 W or less unless otherwise specified. � ¢ : internal component. � 2 : nonflammable resistor. � 1 : fusible resistor. � C : panel designation. Note: The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified. � � � � � U : B+ Line. V : B� Line. H : adjustment for repair. Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. Voltages are taken with a VOM (Input impedance 10 M�). Voltage variations may be noted due to normal production tolerances. Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. Circled numbers refer to waveforms. Signal path. F : FM g : VIDEO/MD E : PB (DECK A) d : PB (DECK B) G : REC (DECK B) m : CHROMA n :Y o : VIDEO J : CD c : digital out � Abbreviation EA : Saudi Arabia model. SP : Singapore model. MY : Malaysia model. HK : Hong Kong model. TW : Taiwan model. IA : Indonesian model. TH : Thai model.

WAVEFORMS � CD SECTION � 1
1.3Vp-p

� VIDEO SECTION � 1
4Vp-p

� MAIN (2/5) SECTION � 7
4.6Vp-p

1
5.5Vp-p

10MHz

44.1kHz

16MHz

IC502 !£ XOUT IC101 %º RFAC

IC509 !ª LRCK

IC501 !¡ XC-OUT

2
2.5V H 1Vp-p

8
4.8Vp-p

2
5.2Vp-p

2
2.11MHz

32.768kHz

APPROX 500mVp-p

IC505 &� COUT

IC509 !¶ BCLK

IC501 !£ X-OUT

IC101 $¡ TE

3
2.5V
2Vp-p

9
4.8Vp-p

3 � PANEL FL SECTION � 1
3.4Vp-p

APPROX 200mVp-p

H

33.8MHz

IC505 ^ª YOUT IC101 #ª FE

IC504 8 384FS

4 4
2.6Vp-p
H 1Vp-p

0
12.5MHz
3.8Vp-p

IC601 &� X OUT

�

7.5µsec

IC401 7 COUT

IC504 6 27M

27MHz

IC101 @� MDP

5
2Vp-p

!¡
2.8Vp-p

� �

H

33.8MHz

IC401 1 YOUT

IC504 !�

6
5.8Vp-p 27MHz

IC509 1 XT1

For printed wiring boards.
Note: � X : parts extracted from the component side. � Y : parts extracted from the conductor side. � p : parts mounted on the conductor side. � ® : Through hole. � b : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: (Side B) Parts face side: (Side A)

Parts on the pattern face side seen from the pattern face are indicated. Parts on the parts face side seen from the parts face are indicated.

� Indication of transistor
C Q These are omitted

BC E These are omitted

BE

� 33 �

� 34 �