CX-ZA650 SECTION 1 SERVICING NOTES
Notes on chip component replacement � Never reuse a disconnected chip component. � Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing � Keep the temperature of the soldering iron around 270 �C during repairing. � Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). � Be careful not to apply force on the conductor when soldering or unsoldering. CAUTION: Other Notes The MAIN board and the PANEL board are connected each other by the connectors soldered directly on boards. To disconnect the connectors, release the connector lock. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the exterior.
Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. LASER DIODE AND FOCUS SEARCH OPERATION CHECK Carry out the �S curve check� in �CD section adjustment� and check that the S curve waveforms is output three times.
